DAU Ges.m.b.H and CO.KG was founded in 1970 has been involved in the manufacture of electromechanical components for the high power electronics industry.

DAU offers a comprehensive range of thermal management products such as:

• Heat Spreaders (Stamping, Aluminium Extrusions, Die Casting)
• Naturally Convected Heat Sinks (Aluminium Extrusions and High Power Bonded Fin Technology)
• Fan Forced Heat Sinks (Bonded Fin Technology, Metal Bond Technology)
• Attachment Devices (Springs, Clips, Adhesives)
• Liquid Cooling Devices (Water Cooling, Fluid Cooling, Oil Cooling)
• Heatpipes and Heatpipe assemblies (both Mesh Type Wick and Sintered Wick Heatpipes)
• Heatexchangers and Heatpipe Heatexchangers (Liquid to Air, Liquid to Liquid)
• Interface Materials (bought-in product from well known suppliers)

In additional, the company offers products like:

Aircooled Heat Sinks:

• Bonded fin heat sinks
• Soldered fin heat sinks
• Pressed fin heat sinks
• Profilescostum specific heat sinks
• PC board heat sinks
• Processor heat sinks

Liquid Cold Heat Sinks:

• Liquid cold plates
• KLEASY system Series KLD
• Easy system series KW
• Liquid cold plates KS
• Liquid cold plates UW
• Liquid cold plates KSK
• Hockey pack cooler KWK
• Hockey pack cooler LC KW-K
• Processor liquid cold plates
• Customized liquid coolers

Heat pipes:

• Standard cylindrical heat pipes
• Heat pipe power semiconductor cooling
• Heat pipe heat exchanger
• Heat pipe processor cooling
• Custom specific heat pipe applications
• Heat pipes for plastic moulding applications

Passive Electronic Components:

• Foil trimmer capacitors
• Ceramic trimmer capacitors
• Air trim capacitors tuning tools
• Wire wound potentiometers
• Wirewound preset poti
• Cermet potentiometers
• SMD and chip inductors
• SMD transformers
• Varactor diodes

Few of its partners are Mikkelsen Electronics AS, HS Electro Connex KB, DAU Asia Ltd, ELSAP s.r.l, EBG d.o.o, RODIA INT - Ltd, HS Electro Connex KB, Dau Thermal Solutions Inc, etc.