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Product Details

Assembly Division Capabilities

Company: PCB Technologies Ltd.
Details :


Design, Engineering, and E.C.O Support
SMT,  4 lines (see details in equipment section)
Wave Soldering  (see details in equipment section)
Press fit connectors insertion machine
BGA, Ceramic BGA and Micro BGA capability
BGA rework and Inspection capability
Re-Balling of BGA components
ROHS compliance
Mechanical assembly
(including boxes, harnesses, cables)
ICT, J-Tag, Functional testing
and testability design support
3D X-Ray for BGA quality
ICT Fixture development and programming
ESS and Burn-in

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