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Product Details

PCB Capabilities

Company: PCB Technologies Ltd.
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Special Capabilities

 

buried capacitors - In R&D.
buried resistors.
Via filling capabilities with functional materials:
Dilectric: PETERS plugging paste, ceramic-epoxy based
(PP 2765-SD for example) – In mass production (OPTION OF SELECTIVE VIA FILLING).
Conductive:

  • Electro-plating Copper – In mass production
  • Plugging with conductive fill, such as Silver paste etc. – In R&D.

Micro-via & blind via plug.
Carbon paste: for touch pads.
STACKED VIA.

Comment: PCB Technologies and our staff of specialists aspire to promote and endorse
novel ideas and technological developments geared towards the adaptation of different plugging materials, in order to meet individual customer requirements.


Combined / Hybrid boards: combinations of different types of laminates.
Specialists in RF circuits:

  • RF (ANTENNA) double sided circuits with dimensions of 0.5X2.5 m.
  • Laser ablation of cavities on RF circuits.
  • Extreme accuracy in line etching.

Back-panels: with thickness < 8.5 mm (in mass production).
Back drilling:
Silver paste for EMI  [electro magnetic interference] Shielding.
SELECTIVE FINISHING
METAL CORES (AL/CU/CIC) WITH ROSIN FILLING.

 

Materials
PCB Technologies works and partners with world-class qualified suppliers that use the best materials available for printed circuit board (PCB) manufacturing. The company's detailed and comprehensive material inspection process ensures that suppliers comply with all requirements for satisfying customer needs.

Materials used by the company include:

Glass epoxy (GF) laminate, Tg - 180ºc Epoxy
Polyamide (GI) laminate
BT/Epoxy (GMN)
Teflon base  (differing dielectric constant from various manufacturers)
with Aluminum or brass backing.
Thermount (BI, aramid) epoxy and polyamide base
Kapton (adhesive and adhesiveless)
No flow prepregs (GF, GI, acrylic)
Materials for high-speed applications (NELCO 4000-13 SI).
GETEK
RO 6000, RO 4000, RO 3000
ARLON'S 99ML THERMALLY CONDUCTIVE MULTIFUNCTIONAL EPOXY
NELCO9220
PP SPEED BOARD

 

Finishing Technologies
PCB Technologies understands the importance of board finishing in high-level assembly and testing. Based on customer, product and application requirements, the company has developed various finishing technologies facilitating the production of high-performance printed circuit boards (PCBs) that are durable, reliable and stable.
PCB Technologies offers a high-quality, process-controlled orientation that provides customers with the most appropriate solution for any finishing technology required.

The types of finishing available include:

Hot air solder leveling (HASL) Tin-lead.
Organic Solderable Preservative (OSP)
Electro less Nickel and Immersion Gold  
Immersion Silver
Immersion Tin
Electrolytic Nickel/Gold, hard and soft (wire bondable)
Electrolytic Mat Tin
Selective Nickel/Gold
Via holes plugging (Copper, Silver solder mask, epoxy)
Carbon paste: used for touch pads.

Selective finishing:

Immersion & Electroplating Gold.
Combination of Electro-plating & Immersion finishing.
ENIG with Electrolytic mat tin.
Electrolytic mat tin with electrolytic Ni-Au.

Heat sink finishing:

Electrolytic Nickel.
Electrolytic soft Gold

Related Document: PCB CapabilitiesPCB Capabilities

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