Sep 19, 2017   SOURCE: BusinessWire

Global Embedded Die Packaging Technology Market - Insights, Analysis, Market Shares and Forecast to 2023 - Research and Markets

The "Global Embedded Die Packaging Technology Market, 2017-2023" report has been added to Research and Markets' offering.

The global embedded die packaging technology market is expected to rise at a CAGR of 14.8 % during the forecast period 2016-2023. Embedded die packaging technology provides many advantages such as improved electrical and thermal performance, compact size, opportunity for cost reduction, heterogeneous integration, streamlined logistics for Original Equipment Manufacturers (OEMs) etc. The key factor driving the growth of global embedded die packaging technology market is the increasing number of portable electronic devices.

North America is the largest market region for global embedded die packaging technology market in terms of market revenue share. The key factors driving the growth of North American embedded die packaging technology market are the surging demand and adoption of IoT devices, growing telecommunication and automotive industry. Embedded die packaging technology is extensively used in embedded systems such as microcontroller chips and integrated circuits, digital signal processor. These electronic components are then used in mobile phones, mp3 players, digital cameras etc.

Furthermore, North America has the largest number of smartphone users. Thus, increasing smartphone user in North America drives the demand for embedded die packaging technology thereby contributing to the market growth in North America. Asia Pacific is expected to emerge as the fastest growing market region owing to the presence of key market players such as Fujikura, ASE group, Taiwan semiconductor manufacturing company etc. in Asia Pacific region.

Companies Mentioned

  • Amkor Technology (U.S.)
  • Ase Group (Taiwan)
  • AT & S (Austria)
  • Dow Corning Corporation(U.S.)
  • EV Group (Taiwan)S
  • Fujikura Ltd. (Japan)
  • General Electric Corporation (U.S.)
  • Infineon Technologies As (Germany)
  • Microsemi Corporation (U.S.)
  • Microvision Inc. (U.S.)
  • Schweizer Electronics Ag (Germany)
  • Semiconductor Manufacturing International Corporation (Austria)
  • Suss Microtec (Germany)
  • Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
  • TDK Corporation (Japan)

Key Topics Covered:

1. Introduction

2. Market Overview

3. Market Determinants

4. Market Segmentation

5. Competitive Landscape

6. Geographical Analysis

7. Company Profiles

For more information about this report visit https://www.researchandmarkets.com/research/5hjvlx/global_embedded