Dec 12, 2017   SOURCE: PR NewsWire

TE Connectivity to Showcase Data Center Connectivity Innovations at DesignCon 2018

HARRISBURG, Pa., Dec. 12, 2017 /PRNewswire/ -- TE Connectivity (TE), a world leader in connectivity and sensors, today announced that it will showcase a range of industry-leading data communications connectivity solutions in booth 817 at the DesignCon 2018 expo on January 31-February 1 in Santa Clara, California. In addition, TE's Nathan Tracy will speak on a panel of experts discussing the topic, "Examining System Challenges When Implementing Next Generation Data Center Input/Output (I/O) Connectivity."

Sneak peak of TE's featured live demos in their booth:

    --  Sliver 2.0, an extension of the Sliver interconnect family, which has
        been identified as the standard and required product by several industry
        consortias like COBO, Gen-Z, EDSFF and Open Compute Project (OCP) for
        today's and next-generation server and storage designs.
    --  QSFP-DD, OSFP, copper cables and microQSFP high-speed I/O solutions
        showcasing thermal performance, RU faceplate density and data throughput
        capabilities.
    --  Industry-leading STRADA Whisper high speed backplane connectors,
        featuring a continuously expanding range of configurations including
        direct plug orthogonal, mezzanine, and cables all delivering at 56 Gbps,
        112 Gbps and beyond.

"Signal integrity, packaging density, power delivery, and thermal management are all key challenges as equipment designers roll out new networking systems for 400-Gigabit Ethernet and beyond," said Nathan Tracy, standards manager, TE Connectivity. "TE is demonstrating robust solutions that meet these challenges."

"We are proud to be at DesignCon showcasing our cutting-edge innovations like Sliver interconnects and scalable STRADA Whisper solutions, which revolutionized the way we design products for speed and performance. We look forward to working with our customers and leading entrepreneurs on co-creating the next leading integrated solutions for the data communications market," Phil Gilchrist, vice president and CTO, TE Connectivity.

Learn more on our DesignCon 2018 events page.

ABOUT TE CONNECTIVITY
TE Connectivity Ltd. (NYSE: TEL) is a $13 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 78,000 employees, including more than 7,000 engineers, working alongside customers in nearly 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.

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TE Connectivity, TE, TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies.
CDFP is part of the ZXP® family of connectors and uses ZXP technology. ZXP is a trademark of Molex, LLC
Other logos, product(s) and/or company names might be trademarks of their respective owners.

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SOURCE TE Connectivity