Feb 23, 2018   SOURCE: BusinessWire

Hermetic Packaging Market by Configuration, Type, End-User Industry, Geography - Global Forecast to 2022 - ResearchAndMarkets.com

The "Hermetic Packaging Market by Configuration (Multilayer Ceramic, Metal Can, and Pressed Ceramic Packages), Type (Ceramic-Metal and Glass-Metal Sealing), End-User Industry, Geography - Global Forecast to 2022" report has been added to ResearchAndMarkets.com's offering

The hermetic packaging market is expected to grow from USD 3.25 billion in 2018 to 4.52 billion by 2023, at a CAGR of 6.80% between 2018 and 2023.

The need of a packaging method that can protect highly sensitive electronic components for several years and the growing demand for hermetically packaged components from industries, such as automotive, electronics, and aeronautics and space, are some of the major drivers for the hermetic packaging market. However, stringent military standards for hermetic packaging is a key factor restraining the growth of this market.

The military & defense industry is expected to capture the largest market share in 2018. High defense budget allocation by the North American countries-the US, Canada, and Mexico; and rising adoption of hermetically packaged components for border security needs by developing countries, such as China and India, across APAC are expected to contribute to the growth of the hermetic packaging market for the military & defense industry.

The market in APAC is expected to hold the largest share by 2023, and is estimated to grow at the highest rate. With the increasing population, energy needs of the countries in APAC are also expected to increase. Along with this, the developing countries, such as China and India, are expected to sustain the high GDP growth rate. These factors are expected to create huge opportunities for manufacturers of hermetically packaged components in APAC.

The key market players profiled in the report are:

  • Schott AG (Germany)
  • AMETEK (US)
  • Amkor Technology (US)
  • Texas Instruments (US)
  • Teledyne Microelectronics (US)
  • Kyocera Corporation (Japan)
  • Materion Corporation (Japan)
  • Egide (France)
  • Micross Components. (US)
  • Legacy Technologies Inc. (US)

Key Topics Covered:

1 Introduction

2 Research Methodology

3 Executive Summary

4 Premium Insights

5 Market Overview

6 Hermetic Packaging Market, By Configuration

7 Hermetic Packaging Market, By Type

8 Hermetic Packaging Market, By Application

9 Hermetic Packaging Market, By Industry

10 Geographic Analysis

11 Competitive Landscape

12 Company Profiles

  • Ametek
  • Amkor
  • CHI
  • Coat-X
  • Complete Hermetics
  • Egide
  • Hermetic Solutions Group
  • Intersil
  • Kyocera
  • Legacy Technologies
  • Materion
  • Micross Components
  • Primoceler
  • SGA Technologies
  • SHP
  • Schott
  • Stratedge
  • Teledyne Microelectronics
  • Texas Instruments
  • Willow Technologies

For more information about this report visit https://www.researchandmarkets.com/research/jq87qm/hermetic?w=4