TE Connectivity exhibits data and power connectivity solutions at OCP Summit 2018
TE Connectivity exhibits data and power connectivity solutions at OCP Summit 2018
Innovative solutions designed into myriad Open Compute Platforms
HARRISBURG, Pa., March 20, 2018 /PRNewswire/ -- TE Connectivity (TE), a world leader in connectivity and sensors, today announced that it will showcase a broad range of data and power connectivity solutions in booth B23 at the 2018 Open Compute Project (OCP) US Summit being held March 20-21 at the San Jose Convention Center in California. During the show, TE will launch its 48V Bus Bar Connectors and Cable Assemblies to the market (see "TE Connectivity introduces 48V bus bar connectors and cable assemblies," also released today).
SHOW: Open Compute Project (OCP)
Summit 2018
DATE: March 20-21, 2018
WHERE: San Jose Convention Center
Booth #B23
San Jose, California
TE is a global industrial technology company delivering high-performance data and power connectivity solutions that can be designed for tomorrow's next-gen data center equipment needs. The company's products have been incorporated into server, storage, networking and artificial intelligence (AI) products across the OCP show floor. In its own booth, TE will display solutions for internal connectors and cable assemblies, external I/O, power, board-to-board connectivity and socket connectivity. TE experts will be on-site to show attendees how these solutions can address a wide variety of applications in next-generation products based on OCP reference designs. Products on site include:
-- Our new 48V power connectors and cable assemblies for Open Compute
Project reduce cost through lower power consumption and simple design.
-- Sliver Card Edge Connectors and Internal Cable Assemblies enable your
next generation designs to address your packaging and high-speed
obstacles.
-- STRADA Whisper Two Piece Board to Board Connectors and Cable Assemblies
are an industry leading, next- generation interface that supports
traditional orthogonal and cabled backplane applications with future
friendly data rate capabilities while addressing density requirements.
-- QSFP-DD, OSFP, Copper Cables and microQSFP high-speed I/O solutions with
demonstrations on thermal performance, RU faceplate density and data
throughput capabilities.
"The Open Compute Project is bringing broad interoperability, high performance and high efficiency to data center equipment designs," said Nathan Tracy, Technologist, System Architecture Team and Manager of Industry Standards. "As a technology-driven ecosystem partner, TE is proud to be displaying its range of OCP-compliant solutions at the OCP Summit."
To learn more about TE's presence at the OCP Summit, click here.
ABOUT TE CONNECTIVITY
TE Connectivity Ltd. (NYSE: TEL) is a $13 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 78,000 employees, including more than 7,000 engineers, working alongside customers in nearly 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.
STRADA Whisper, TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies.
zQSFP+ is part of the ZXP® family of products and uses ZXP technology. ZXP is a trademark of Molex, LLC.
Other logos, product(s) and/or company names might be trademarks of their respective owners.
CONTACT: Megan Veres, TE Connectivity, 717-986-7227, megan.veres@te.com
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SOURCE TE Connectivity
