TE Connectivity showcases data and power connectivity solutions at OCP Summit
HARRISBURG, Pa., March 14, 2019 /PRNewswire/ -- TE Connectivity (TE), a world leader in innovative connectivity solutions for high-speed computing and networking applications, will showcase a broad range of data and power connectivity products in booth A33 at the 2019 Open Compute Project (OCP) US Summit March 14-15 at the San Jose Convention Center.
TE is a vertically-integrated supplier delivering high-performance data and power connectivity solutions. The company's products have been incorporated into server, storage, networking and artificial intelligence (AI) products across the OCP show floor. In its own booth, TE will display innovative power solutions along with solutions for internal input/output (I/O), external I/O, board-to-board connectivity, and socket connectivity. TE experts will be on hand to show attendees how these solutions can address a wide variety of applications in next-generation products based on OCP reference designs. TE's showcase will include:
Internal interconnects: Internal high speed cable and connector solutions can achieve about one-third the loss or three times the reach of advanced printed circuit board routing. Coupled with our Sliver and STRADA Whisper connector technologies, these solutions can deliver the performance needed to address next generation 56G and 112G lanes. TE's high performance internal interconnects address the needs for high data rates with robust signal integrity and power delivery through mate/unmate, including blind-mate service operations commonly found in data center production environments. TE supports jacketed, stranded and sheathed cable solutions to address the bend radius requirements for cable installation and management.
External interconnects: TE continues to be a leader in the industry with I/O solutions for 56G- and 112G-based interconnect solutions supporting 50G, 100G, 200G and 400G links from the data center server, through fabric and spine network layers and equipment for wide-area-network, data center-to-data center connections. The company's solutions not only address the needs for high data rates but can also provide high density, high reliability, compatible solutions for robust interoperability. TE's high performance cable assemblies can be tailored to support the mechanical and electrical requirements for many applications.
Power Solutions: TE's power connectors, cable assemblies and value-added bus bar solutions can provide simple yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria, while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can realize operational and overall system cost savings with TE power products that support low energy consumption. These products are compatible with specifications for use in rack-level bus bar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.
Board-to-Board and Socket: High performance board-to-board products address the needs for high data rates with robust signal integrity and power delivery through mate/unmate, including blind-mate service operations commonly found in data center production environments. TE's socket portfolio includes standard CPU sockets and custom CPU sockets to help customers that want to incorporate their own semiconductor technology and memory interconnects. The memory interconnects are manufactured to JEDEC industry standards for dual in-line memory modules (DIMM). These connectors can provide end latches for module retention and ejection as well as mechanical voltage keying.
"TE has supported the OCP community for years, and we are the go-to source for high-performance power and data connectivity solutions," said Eric Himelright, vice-president for data and devices, product management at TE Connectivity. "Our broad engineering expertise and constant drive to innovate mean that our solutions deliver on the speed, density, and high efficiency requirements of OCP designers, and we are proud to be showcasing our product line at the 2019 OCP U.S. Summit."
ABOUT TE CONNECTIVITY
TE Connectivity Ltd. is a $14 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.
TE Connectivity, TE, TE connectivity (logo), STRADA Whisper, Sliver, and EVERY CONNECTION COUNTS are trademarks owned or licensed by the TE Connectivity Ltd. family of companies. Other logos, product(s) and/or company names might be trademarks of their respective owners.
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