Global Underfill Material Market Expected to Generate a Revenue of $535.56 Million During the Forecast Period, 2017-2026: Impacted by Rising Demand in Automative and Military Industries - ResearchAndMarkets.com

The "Global Underfill Material Market Analysis 2019" report has been added to ResearchAndMarkets.com's offering.

The Global Underfill Material Market is expected to reach $535.56 million by 2026 growing at a CAGR of 9.3% from 2017 to 2026.

Underfill materials are fused formulations of inorganic fillers and organic polymers which can be used as a semiconductor packaging to attain better quality of thermo-mechanical presentation. Rising demand in automotive and military industries is the major key factors driving the market growth. Moreover, flip chip packaging of low-k devices is providing opportunities for the market growth. However, reducing profit margins of underfill suppliers may restrain the market growth.

By Product, Capillary Underfill Material (CUF) held considerable growth during forecast period due recent developments in the electronic industry. It is used in several packaging techniques which include ball grid array, chip scale packaging, flip chip, and others.

Key Questions Answered in this Report:

  • How this market evolved since the year 2016
  • Market size estimations, forecasts and CAGR for all the segments presented in the scope
  • Key Market Developments and financials of the key players
  • Opportunity Analysis for the new entrants
  • SWOT Analysis of the key players
  • Fastest growing markets analysed during the forecast period.

Key Topics Covered:

1 Market Synopsis

2 Research Outline

2.1 Research Snapshot

2.2 Research Methodology

2.3 Research Sources

2.3.1 Primary Research Sources

2.3.2 Secondary Research Sources

3 Market Dynamics

3.1 Drivers

3.2 Restraints

4 Market Environment

4.1 Bargaining power of suppliers

4.2 Bargaining power of buyers

4.3 Threat of substitutes

4.4 Threat of new entrants

4.5 Competitive rivalry

5 Global Underfill Material Market, By Application

5.1 Introduction

5.2 Ball Grid Array (BGA)

5.3 Chip Scale Packaging (CSP)

5.4 Flip Chips

6 Global Underfill Material Market, By Product

6.1 Introduction

6.2 Capillary Underfill Material (CUF)

6.3 No Flow Underfill Material (NUF)

6.4 Molded Underfill Material (MUF)

9 Global Underfill Material Market, By Geography

9.1 Introduction

9.2 North America

9.3 Europe

9.4 Asia Pacific

9.5 South America

9.6 Middle East & Africa

10 Strategic Benchmarking

11 Vendors Landscape

11.1 Zymet

11.2 Yincae Advanced Material

11.3 Nordson Corporation

11.4 NAMICS Corporation

11.5 Master Bond

11.6 Henkel

11.7 H.B Fuller

11.8 Finetech

11.9 Epoxy Technology

For more information about this report visit https://www.researchandmarkets.com/r/7ieork