Aug 11, 2020   SOURCE: BusinessWire

Global Advanced Packaging Market Outlook (2019 to 2027) - Featuring ASE Technology Holding, Qualcomm Technologies & Texas Instruments Among Others - ResearchAndMarkets.com

The "Advanced Packaging - Global Market Outlook (2019-2027)" report has been added to ResearchAndMarkets.com's offering.

The Global Advanced Packaging market accounted for $29.42 billion in 2019 and is expected to reach $73.36 billion by 2027 growing at a CAGR of 12.1% during the forecast period.

Some of the key factors propelling market growth include exponential adoptions of IoT by various industry verticals, rising demand for smart as well as power-efficient devices by the consumers, increasing trend of advanced architecture in electronic products, and favourable government policies and regulations in developing countries.

However, high initial costs of advanced packaging with higher maintenance costs of these systems are likely to hamper the market. Moreover, the rise in the usage of advanced packaging by the automotive industry is creating further large opportunities for the players operating in the advanced packaging market.

Advanced packaging is a supporting case that prevents physical damage and corrosion to silicon wafers, logic units, and memory, during the final stage of semiconductor manufacturing process. This packaging allows the chip to be connected to a circuit board. In addition, it involves grouping of a variety of distinct techniques, which include 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.

Companies Mentioned

  • ASE Technology Holding Co., Ltd.
  • Qualcomm Technologies Inc.
  • Taiwan Semiconductor Manufacturing Company
  • Renesas Electronics Corporation
  • Texas Instruments
  • Amkor Technology, Inc.
  • Intel Corporation
  • Semiconductor Manufacturing International Corporation,
  • STATS ChipPAC Ltd
  • SSS MicroTec SE
  • International Business Machines Corporation
  • Microchip Technology
  • United Microelectronics Corporation
  • Samsung Electronics Co. Ltd
  • Chipbond Technology Corporation
  • Advanced Semiconductor Engineering Inc.

What the report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter's five forces analysis, SWOT analysis, etc.
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company Profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Key Topics Covered:

1 Executive Summary

2 Preface

2.1 Abstract

2.2 Stake Holders

2.3 Research Scope

2.4 Research Methodology

2.4.1 Data Mining

2.4.2 Data Analysis

2.4.3 Data Validation

2.4.4 Research Approach

2.5 Research Sources

2.5.1 Primary Research Sources

2.5.2 Secondary Research Sources

2.5.3 Assumptions

3 Market Trend Analysis

3.1 Introduction

3.2 Drivers

3.3 Restraints

3.4 Opportunities

3.5 Threats

3.6 Technology Analysis

3.7 End User Analysis

3.8 Application Analysis

3.9 Product Analysis

3.10 Emerging Markets

3.11 Impact of Covid-19

4 Porters Five Force Analysis

4.1 Bargaining power of suppliers

4.2 Bargaining power of buyers

4.3 Threat of substitutes

4.4 Threat of new entrants

4.5 Competitive rivalry

5 Global Advanced Packaging Market, By Technology

5.1 Introduction

5.2 Wafer Level CSP

5.3 Flip Chip CSP

5.4 Fan Out wafer-level packaging (FO WLP)

5.5 Flip-Chip Ball Grid Array

5.6 2.5D/3D

5.7 Chip-Scale Packaging

5.8 3D Integrated Circuit Packaging

5.9 Fan Out Silicon in Package

5.10 3D Wafer Level Package

5.11 Fan-in wafer-level packaging (FI WLP)

5.12 5D

5.13 3.0 DIC

5.14 Other Types

5.14.1 Flip-Chip Package-in-Package

5.14.2 Embedded Die

5.14.3 Thin Quad Flat Packages

6 Global Advanced Packaging Market, By End User

6.1 Introduction

6.2 Healthcare

6.3 Aerospace & Defense

6.4 Consumer Electronics

6.5 Automotive

6.6 Industrial

6.7 IT and Telecommunication

6.8 Other End Users

6.8.1 Paper & Pulp

6.8.2 Oil & Gas

7 Global Advanced Packaging Market, By Application

7.1 Introduction

7.2 MEMS & Sensor

7.3 Misc Logic and Memory

7.4 Analog & Mixed Signal

7.5 Wireless Connectivity

7.6 Optoelectronic

7.7 Light-emitting Diode (LED)

8 Global Advanced Packaging Market, By Product

8.1 Introduction

8.2 Intelligent Technology

8.3 Modified Atmosphere

8.4 Active Technology

9 Global Advanced Packaging Market, By Geography

9.1 Introduction

9.2 North America

9.3 Europe

9.4 Asia Pacific

9.5 South America

9.6 Middle East & Africa

10 Key Developments

10.1 Agreements, Partnerships, Collaborations and Joint Ventures

10.2 Acquisitions & Mergers

10.3 New Product Launch

10.4 Expansions

10.5 Other Key Strategies

11 Company Profiling

For more information about this report visit https://www.researchandmarkets.com/r/s72nbo