May 26, 2017   SOURCE: PR NewsWire

System-in-Package (SiP) Technology Market 2015-2022 - Global Strategic Business Report 2017 - 2.5D IC Packaging Technology Dominates SiP Market - Research and Markets

DUBLIN, May 26, 2017 /PRNewswire/ --

Research and Markets has announced the addition of the "System-in-Package (SiP) Technology - Global Strategic Business Report" report to their offering.

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The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

Also, a six-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million.

The Global market is further analyzed by:

Interconnection Technology

    --  Wire Bonding
    --  Flip-Chip

End-Use Sector 

    --  Consumer Electronics
    --  Communications
    --  Aerospace & Defense
    --  Automotive
    --  Others

The report profiles 51 companies including many key and niche players such as

    --  Amkor Technology, Inc. (USA)
    --  ASE Group (Taiwan)
    --  ChipMOS Technologies Inc. (Taiwan)
    --  Fujitsu Limited (Japan)
    --  GS Nanotech (Russia)
    --  Insight SiP (France)
    --  Intel Corporation (USA)
    --  Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
    --  Kulicke & Soffa Pte Ltd. (Singapore)
    --  Nanium S.A. (Portugal)
    --  O.C.E. Technology Ltd. (Ireland)
    --  Powertech Technologies, Inc. (Taiwan)
    --  Renesas Electronics Corporation (Japan)
    --  Samsung Electronics Co., Ltd. (South Korea)
    --  ShunSin Technology (Zhongshan) Limited (China)
    --  Si2 Microsystems Private Limited (India)
    --  Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
    --  STATS ChipPAC Ltd. (Singapore)
    --  Unimicron Corporation (Taiwan)

Key Topics Covered:

1. INDUSTRY OVERVIEW 

    --  Small Form Factor, High Performance & Energy Efficiency Needs of
        Electronics Industry Bolster Demand for System-in-Package (SiP)
        Technology
    --  Growing Demand for Miniature and High Performance Electronic Devices &
        Systems Drive SiP Market
    --  Developing Countries Offer Growth Prospects
    --  Flip Chip Type of Interconnection Technology Leads SiP Technology Market
    --  Consumer Electronics Sector Fuels Revenue Growth in SiP Market
    --  Portable Electronic Devices Stir Demand for Flat Packaging
    --  2.5D IC Packaging Technology Dominates SiP Market
    --  Challenges Confronting the SiP Market

2. MARKET TRENDS & GROWTH DRIVERS 

    --  Importance of SiP Technology in Electronics
    --  Rising Demand for High Performance and Compact Consumer Electronics
        Drive Growth
    --  List of Select SiP Solutions for Connected Devices
    --  Growing Demand for Smart, Energy Efficient Electronics Provides Business
        Case for SiP
    --  Growing Sales of Smartphones Bode Well for SiP Market
    --  Growing Demand for Tablet PCs
    --  Applications in Set Top Boxes Boosts Demand for SiP Technology
    --  Computing Devices
    --  IoT Opens New Growth Avenues for SiP
    --  TSVs for Die-to-Die/Die-to-Package Substrate Communication
    --  Advanced Nodes Demand Innovative Package Technologies
    --  PCB Considerations Vital for Using SiP in IoT Systems
    --  WLCSP for Compact Form Factors
    --  Trend Towards Smart Homes Offers Growth Opportunities

    --  Miniaturization of Electronics
    --  A Major Growth Driver for SiP
    --  Need for Compact and High Speed Performance Products Spurs Market Growth
    --  Shift in Direction towards More Than Moore's Law Benefits the SiP Market
    --  SMBs Spur the Adoption of SiP

3. TECHNOLOGY OVERVIEW 

    --  System in Package (SiP): A Definition
    --  SiP Configurations, Features and Target Applications
    --  Development of SiP
    --  SiP Packaging
    --  Package-on-Package SiP
    --  Power Quad Flat No-Lead SiP
    --  Stacked Die SiP
    --  System-in-Package Land Grid Array
    --  SiP Benefits

4. RECENT INDUSTRY ACTIVITY 

    --  Amkor Announces Product Qualification for SWIFT Packaging
    --  3D Glass Solutions Collaborates with TE Connectivity
    --  Silicon Labs Introduces New Bluetooth SiP Module
    --  MediaTek Unveils SoCs for Fitness and Healthcare Devices
    --  Intel Launches Intel® Curie Module SiP
    --  Octavo Systems Launches OSD3358 SiP Device
    --  UTAC Collaborates with AT & S
    --  MediaTek Unveils New SiP Chipsets
    --  JCET Receives Order to Assemble SiP Modules for Apple

5. FOCUS ON SELECT GLOBAL PLAYERS

6. GLOBAL MARKET PERSPECTIVE

Total Companies Profiled: 51 (including Divisions/Subsidiaries 53) 

    --  The United States (16)
    --  Japan (3)
    --  Europe (8)
    --  - France (4)
    --  - Rest of Europe (4)
    --  Asia-Pacific (Excluding Japan) (25)
    --  Middle East (1)

For more information about this report visit http://www.researchandmarkets.com/research/hcfb8c/systeminpackage

Media Contact:

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com

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