Jun 2, 2017   SOURCE: PR NewsWire

Quik-Pak Exhibits Air Cavity Plastic QFNs, Overmolded QFNs at IEEE MTT International Microwave Symposium (IMS) June 4-9, Honolulu HI, Booth 732

SAN DIEGO, June 2, 2017 /PRNewswire-iReach/ -- Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions for complex devices, will exhibit Air Cavity Plastic QFN Packages and Overmolded QFN Packages in Booth 732 at the IEEE MTT International Microwave Symposium (IMS), June 4-9, 2017 in Honolulu, HI.

    --  Quik-Pak's air cavity plastic QFN packages, also known as Open-molded
        Plastic Packages (OmPP), are used in RF/microwave, MEMS and sensor
        applications. OmPPs feature gold plating for wire bondability; RoHS- and
        REACH-compliant green molding compound; short, highly conductive
        interconnects and JEDEC outlines. Matching ceramic, plastic, quartz or
        glass lids with b-stage epoxy seals are available. More than 30
        off-the-shelf sizes are in stock for prototype, mid-volume and
        production-volume requirements. Custom designs are also available. More
        details can be found in Quik-Pak's product brochure
    --  Quik-Pak's overmolded, open-tooled QFN packages are well suited for
        quick-turn engineering builds, high mix/low volume assembly and onshore
        volume production. The QFNs are available for purchase off the shelf in
        over 35 designs, from 2x2 mm to 12x12 mm, multiple thicknesses. Five-day
        delivery of assembled QFNs is standard. All QFNs are RoHS compliant and
        utilize NiPdAu-plated lead frames. Custom designs are also available
        with quick lead-times.

"Our versatile, cost-effective QFN platform has become the package of choice for single die, multi-die, SiPs and stacked die," said Quik-Pak Global Sales and Marketing Director Casey Krawiec. "We look forward to discussing device packaging for RF/microwave applications with IMS attendees. Our QFNs offer great convenience to everyone who uses them. They will help you get your die to market faster."

Quik-Pak also offers complete assembly services to help accelerate time to market, including flip chip and wire bonding (Au, AI and Cu from 0.6 mil to 20 mil diameters), wafer thinning, dicing, and pick and place.

The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. More than 400 companies will exhibit the latest developments in packaging, materials, devices, components and subsystems, as well as design and simulation software and test/measurement equipment.

Quik-Pak, a division of Promex, provides IC packaging, assembly and wafer preparation services in its ISO 9001:2008 certified, ITAR registered facility in San Diego, California. The company's overmolded QFN/DFN packages and pre-molded air cavity QFN packages provide a fast, convenient solution for prototype to full production needs. Same-day assembly services are provided to reduce time to market. More information is available at http://www.icproto.com or by calling 858-674-4676.

Media Contact: Mar Junge, c3PR, 408-730-8506, mar@c3pr.com

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SOURCE Quik-Pak