Feb 21, 2018   SOURCE: PR NewsWire

Global 3D IC & 2.5D IC Packaging Market 2015-2017 & 2018-2027 - Increasing Demand for High-End Computing, Servers, and Data Centers

DUBLIN, Feb. 21, 2018 /PRNewswire/ --

The "Global 3D IC & 2.5D IC Packaging Market Analysis & Trends - Industry Forecast to 2027" report has been added to ResearchAndMarkets.com's offering.

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The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027.

This industry report analyzes the market estimates and forecasts of all the given segments on global as well as regional levels presented in the research scope. The study provides historical market data for 2015, 2016 revenue estimations are presented for 2017 and forecasts from 2018 till 2027.

The study focuses on market trends, leading players, supply chain trends, technological innovations, key developments, and future strategies. With comprehensive market assessment across the major geographies such as North America, Europe, Asia Pacific, Middle East, Latin America and Rest of the world the report is a valuable asset for the existing players, new entrants and the future investors.

Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

Report Highlights:

    --  The report provides a detailed analysis on current and future market
        trends to identify the investment opportunities
    --  Market forecasts till 2027, using estimated market values as the base
        numbers
    --  Key market trends across the business segments, Regions and Countries
    --  Key developments and strategies observed in the market
    --  Market Dynamics such as Drivers, Restraints, Opportunities and other
        trends
    --  In-depth company profiles of key players and upcoming prominent players
    --  Growth prospects among the emerging nations through 2027
    --  Market opportunities and recommendations for new investments

Key Topics Covered:

1 Market Outline
1.1 Research Methodology
1.2 Market Trends
1.3 Regulatory Factors
1.4 Technology Analysis
1.5 End User Analysis
1.6 Application Analysis
1.7 Strategic Benchmarking
1.8 Opportunity Analysis

2 Executive Summary

3 Market Overview
3.1 Current Trends
3.1.1 Increasing Demand for High-End Computing, Servers, and Data Centers
3.1.2 Rising Demand for Smartphones, Tablets, and Gaming Devices
3.1.3 Recent Technological Developments in 3D IC & 2.5D IC Packaging
3.1.4 Growth Opportunities/Investment Opportunities
3.2 Drivers
3.3 Constraints
3.4 Industry Attractiveness

4 3D IC & 2.5D IC Packaging Market, By Packaging Technology
4.1 3D TSV
4.2 2.5D
4.3 3D Wafer-Level Chip-Scale Packaging (WLCSP)

5 3D IC & 2.5D IC Packaging Market, By End User
5.1 Automotive
5.2 Consumer Electronics
5.3 Medical Devices
5.4 Military & Aerospace
5.5 Telecommunication
5.6 Industrial Sector
5.7 Smart Technologies

6 3D IC & 2.5D IC Packaging Market, By Application
6.1 MEMS/Sensors
6.2 Logic
6.3 Imaging & Optoelectronics
6.4 Power, Analog & Mixed Signal, RF, Photonics
6.5 Memory
6.6 LED
6.6.1 LED Market Forecast to 2027 (US$ MN)

7 3D IC & 2.5D IC Packaging Market, By Geography

8 Key Player Activities
8.1 Mergers & Acquisitions
8.2 Partnerships, Joint Venture's, Collaborations and Agreements
8.3 Product Launch & Expansions
8.4 Other Activities

9 Leading Companies

    --  Intel Corporation.
    --  Toshiba Corp.
    --  Samsung Electronics Co., Ltd.
    --  Stmicroelectronics Nv
    --  Jiangsu Changjiang Electronics Technology Co., Ltd
    --  Taiwan Semiconductor Manufacturing Company Limited
    --  Amkor Technology
    --  United Microelectronics Corp.
    --  Broadcom Ltd.
    --  ASE Group
    --  Pure Storage Inc
    --  Advanced Semiconductor Engineering Group

For more information about this report visit https://www.researchandmarkets.com/research/w4fz66/global_3d_ic_and?w=5

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SOURCE Research and Markets