Mercury Systems Receives $3.1M System-in-Package Order for Weapons Application

Mercury Systems, Inc, announced it received a $3.1 million follow-on order from a leading defense prime contractor for rugged system-in-package (SiP) devices embedding a processor and memory devices in a single, SWaP-optimized package. The order was booked in the Company’s fiscal 2019 second quarter and is expected to be shipped over the next several quarters.

Mercury offers a comprehensive portfolio of microelectronics optimized for weapons applications, spanning both the radio frequency (RF) and digital domains. For assured long-term supply continuity of mission-critical technologies for the U.S. warfighter, the Company has established three Advanced Microelectronics Centers (AMC) located in close proximity to major customers. With design engineering and scalable manufacturing resources housed in the same facility, these AMC facilities deliver precision-engineered microelectronics in high volume production without sacrificing affordability.

“Our Phoenix AMC is honored to receive this order from our valued customer for high-quality microelectronics ensuring the operational readiness of a weapons program critical to our defense posture,” said Iain Mackie, Vice President and General Manager of Mercury’s Microelectronics Secure Solutions group. “Our best-in-class three-dimensional packaging and ruggedization technologies, combined with our secure Defense Microelectronics Activity (DMEA)-accredited facility, uniquely positions Mercury as a domestic supplier of trusted microelectronics.”