Media Alert: Rambus Presents Solutions for AI, 5G and Data Center Applications at DesignCon in Santa Clara, CA

SUNNYVALE, Calif., Jan. 21, 2020 /PRNewswire/ --

     Who:                       Rambus Inc. (Nasdaq: RMBS)




     What:  
            DesignCon 2020




     When:           January 29 - 30: Expo from
                      11:00am - 6:00pm PT

                     January 29: Training Sessions
                      from 9:00am - 4:30pm PT




     Where:          Santa Clara Convention Center
            5001 Great America Pkwy

                     Santa Clara, CA 95054

            
            USA

                     Expo: Rambus Booth #1035

                     Training Sessions: Great
                      America 3 Ballroom

Join Rambus at DesignCon for presentations and demonstrations of our comprehensive suite of interface and security solutions for AI, 5G, data center, edge and automotive applications including GDDR6, HBM2, 112G and security protocol engines.

Come hear our experts in a series of technical training sessions focusing on critical topics including:

    --  5G interface solutions
    --  Chiplet architecture interface alternatives
    --  Memory solutions for artificial intelligence/machine learning (AI/ML)
    --  Interface solutions for enterprise and hyperscale data centers
    --  Emerging requirements for automotive interfaces, and
    --  3D packaging solutions

Full-Day Training Session Details in Great America 3 - Wednesday, January 29, 2020

Interface Solutions for Revolutionary 5G Wireless Infrastructure
9:05 - 9:45 AM PT
Suresh Andani, senior director of product marketing, Rambus

Chiplet Architecture Interface Alternatives
11:05 - 11:45 AM PT
Saman Sadr, vice president of product marketing for IP Cores, Rambus

Closing the Gap: Memory Solutions for AI/ML
12:05 - 12:45 PM PT
Frank Ferro, senior director of product marketing, Rambus

Interface Solutions for Enterprise and Hyperscale Data Centers
2:00 - 2:40 PM PT
Suresh Andani, senior director of product marketing, Rambus

Where the Rubber Meets the Road: Satisfying the Emerging Requirements for Automotive Interfaces
2:50 - 3:30 PM PT
Frank Ferro, senior director of product marketing, Rambus

3D Packaging Solutions
3:45 - 4:25 PM PT
Ming Li, technical director, Rambus

Join us at booth #1035 to see our comprehensive suite of solutions for today's most challenging applications. To learn more, visit rambus.com/designcon.

Follow Rambus:
Company website: rambus.com
Rambus blog: rambus.com/blog
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Inc.
Rambus is a premier silicon IP and chip provider that makes data faster and safer. With 30 years of innovation, we continue to develop the foundational technology for all modern computing systems. Leveraging our semiconductor expertise, Rambus solutions speed performance, expand capacity and improve security for today's most demanding applications. From data center and edge to artificial intelligence and automotive, our interface and security IP, and memory interface chips enable SoC and system designers to deliver their vision of the future. For more information, visit rambus.com.

Press Contact:
Cori Pasinetti
Rambus Corporate Communications
(408) 462-8306
cpasinetti@rambus.com

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SOURCE Rambus Inc.