May 14, 2020   SOURCE: PR NewsWire

Nokia 4G AirScale BBU Teardown 2020: High Level Mechanical & PCB Analysis and Bill of Materials

DUBLIN, May 14, 2020 /PRNewswire/ -- The "Nokia 4G AirScale BBU" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.

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This report provides a comprehensive analysis of the Nokia Networks 4G AirScale Digital Baseband Unit (BBU). The configuration of the 4G AirScale is:

    --  AMIA Subrack
    --  ASIA Common Plug In Unit
    --  ABIA Capacity Plug In Unit

Features

    --  System Functional Description
    --  System Level Block Diagrams
    --  High Level Mechanical Analysis
        --  Heat Sink
    --  High Level PCB Analysis
    --  Component Diagrams
        --  Semiconductor/component locations on PCB
    --  High Level Bill of Materials
        --  Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
        --  Passive/other components (Transformers, Power inductors, Power
            capacitors, power/datacom/optical connectors)
        --  Complete Part Number/Marking
        --  Component Manufacturer Identification
        --  Function Component Description
        --  Package Type
    --  Excludes analysis of low power passive chip resistors, capacitors, and
        inductors

Key Topics Covered

EXECUTIVE SUMMARY

    --  Active/Passive Component Summary

CHAPTER 1: NOKIA AIRSCALE SYSTEM MODULE

    --  Overview of AirScale BTS Portfolio

CHAPTER 2: AMIA SUBRACK

    --  AMIA Guiderails
    --  ASIx Blind Slot Frame
    --  ABIx Blind Slot Frame
    --  AMIA Chassis: External Views and Dimensions
    --  AMIA Chassis: Backplane and Fan Units
    --  AMIA Backplane

CHAPTER 3: ASIA PLUG IN UNIT

    --  ASIA Front Panel & Handles
    --  Power Supply Unit (PSU)
    --  PSU Top Cover Heatsink
    --  PSU Bottom FCTJ Heatsink
    --  PSU Printed Circuit Board Analysis
    --  PSU Input DC Voltage Connector Assembly
    --  PSU DC Busbar Assembly
    --  ASIA FCTJ PCB
    --  eUSB Flash Card
    --  OCXO Module
    --  ASIA FCTJ Bottom Cover

CHAPTER 4: ABIA

    --  ABIA Front Panel
    --  ABIA FSPJ Heatsink
    --  ABIA FSPJ Cover
    --  ABIA FSPJ PCB

For more information about this report visit https://www.researchandmarkets.com/r/10gn3e

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