Jul 13, 2021   SOURCE: BusinessWire

Antenna in Package Patent Landscape 2021 Market Report - Featuring AAC Technologies, Boeing and Broadcom Among Others - ResearchAndMarkets.com

The "Antenna in Package Patent Landscape 2021" report has been added to ResearchAndMarkets.com's offering.

Since 2017, the publisher has been following the intellectual property (IP) trends related to RF front-end devices and their packaging. Recently, the publisher witnessed increasing patenting activity related to PAMiD modules, RF front-end modules, RF filters and switch integration, and antennas for 5G and their packaging.

Packaging of 5G systems requires the integration of RF, analog and digital functions along with passives and other system components in a single module. These systems exemplify the heterogeneous integration trend which becomes more important for 5G. Proximity of the transceiver and front-end module is also important, to reduce size and loss. This is achieved by integrating antennas with the RF module as well as simultaneous modeling of a heat dissipation solution to keep active components in acceptable thermal conditions.

In the mm-wave antenna-in-package solutions, interconnections between transceiver ICs and antennas should result in low insertion loss and acceptable return loss over the frequency range of interest. The other key requirement is the form factor, and to meet it the industry is progressively moving from conventional interconnect techniques such as wire-bonding and flip-chip interconnections to emerging techniques referred to as Fan-Out packaging or IC-embedding.

Flip-chip and Fan-out interconnections were originally developed for high-performance computing or mobile processor applications, but their fine pitch and low electrical parasitic have pushed RF players to use them in their RF/mm-wave modules. Today, these approaches are getting more and more critical for the RF industry and are used in antenna-integrated modules.

In this report, the publisher analyzes the patent landscape related to antenna integrated in package (AiP, AoP). The AiP patent landscape is led by major semiconductor foundries and OSATs, SJ Semiconductor (SJSemi) being the main patent assignee, and it includes any links in the supply chain. Foundries/OSATs (SJSemi/SMIC, TSMC, SEMCO, ASE, SPIL) as well as IDMs/fabless (MediaTek, Qualcomm, Murata, TI, Skyworks) and OEMs (Huawei, Vivo mobile, Oppo mobile) have filed AiP-related patents to protect their structures/designs or manufacturing methods.

Understanding of the current IP players' activities

The publisher has identified more than 140 different entities that have filed patent applications related to AiP. The report provides a clear overview of the most active assignees as well as a presentation of IP newcomers. Furthermore, a patent segmentation reveals the technical position, e.g. WLP, Fan-Out, Flip Chip or antenna type, of each of the main players.

SJSemi, Intel and TSMC have the most significant enforceable portfolio; together they own one third of all granted patents. Over the last few years, SJSemi, TSMC, Samsung, MediaTek, Huawei, AAC Technologies and NCAP have been increasing their patenting activity.

The IP newcomers of the last 2 years are mainly Chinese companies that focus on a wafer-level packaging approach for integrated antenna: Vivo Mobile, OPPO Mobile, Shanghai Xianfang Semiconductor (subsidiary of NCAP), Powertech Technology, Microsilicon Technology, T-Ray Technology, Sky Semiconductor Technology, Xinhua Microelectronics and Unisoc.

The IP white-spaces are shrinking

The patents describe a variety of solutions to design or manufacture antenna systems in package, and not many patents are focused on critical technological bricks. The AiP patent landscape attests to well-mastered packaging solutions that are already available on the market and where the IP "white-spaces" will be quickly limited. Each player has developed and protected its own AiP structures/designs, each providing a solution to answer the different requirements of next-generation handset RF packages. The patents mainly claim specific AiP structures/designs or processes/methods for making them. Asserting owned patents against infringing products is easier with patents claiming an AiP structure/design, and patent litigation on such aspects will thus be inevitable in a growing 5G market.

Companies Mentioned in this Report (non-exhaustive list):

  • A*STAR
  • AAC Technologies
  • ASE
  • AT&S
  • Boeing
  • Bosch
  • Broadcom
  • CETC
  • Chengdu Ruishi Intelligent Technology
  • Chengdu T Ray Technology
  • Chunghwa Precision Test Technology
  • Core
  • Dongwoo Fine-Chem
  • Dupont Electronics
  • Ericsson
  • Forehope Electronic Ningbo
  • Fraunhofer
  • Fujikura
  • GlobalFoundries
  • Guangdong Fozhixin Microelectronics Technology Research
  • Guangdong Xinhua Microelectronic Technology
  • Hanyang University
  • Huawei
  • IBM
  • Imec
  • Innolux
  • Institute of Microelectronics - Chinese Academy of Sciences
  • Intel
  • JCAP
  • JCET
  • Kyocera
  • LG Electronics
  • LS Mtron
  • Mediatek
  • Micron Technology
  • Microsilicon Technology
  • Murata
  • NCAP
  • Nanjing Qinheng Microelectronics
  • National Chung Shan Institute of Science & Technology
  • Nepes
  • New Kojinpeng Private
  • Novaco Microelectronics Technologies
  • Oppo Mobile
  • Powertech Technology
  • Qingdao Geer Intelligent Sensor
  • Qualcomm
  • Raytheon
  • SJ Semiconductor
  • SMIC
  • SPIL
  • STATS ChipPAC
  • Saint Gobain
  • Samsung Electro Mechanics
  • Samsung Electronics
  • Shanghai Amphenol Airwave Communication Electronics
  • Shanghai Xianfang Semiconductor
  • Skyworks
  • Sony
  • Spreadtrum Communication
  • TDK Epcos
  • TSMC
  • Texas Instruments
  • Tsinghua University
  • Vega Grieshaber
  • Vivo Mobile
  • Xiamen Yun Tian Semiconductor Technology

For more information about this report visit https://www.researchandmarkets.com/r/nz1jf2