Oct 10, 2019
GLOBALFOUNDRIES Qualifies Synopsys Fusion Design Platform on 12LP FinFET Platform
Jul 11, 2019
The MOSIS Service Selects Synopsys' IC Validator for Large-scale FinFET SoCs
Jun 04, 2019
Synopsys Fusion Design Platform First to be Certified by Samsung Foundry for 5LPE Process with EUV Technology
May 15, 2019
Shimadzu Corporation selects Mentor's Xpedition PCB design-through-manufacturing flow as its global standard
May 14, 2019
Pulsonix 10.5 PCB Design Tools Get New 3D Capabilities and Constraint Rules as Part of its User Request Release
Mar 18, 2019
Synopsys Unveils IC Validator NXT to Cut Physical Signoff Cycle by 2X
Oct 23, 2018
Synopsys Custom Compiler Doubles New Customer Adoptions, Introduces New Release
Oct 09, 2018
Mentor releases optimized flow, new fill automation for GLOBALFOUNDRIES' 22FDX IC manufacturing process
Oct 01, 2018
Synopsys Digital and Custom Design Platforms Certified on TSMC 5-nm EUV-based Process Technology
Jun 18, 2018
Mentor launches Calibre RealTime Digital to help cut weeks off of IC design signoff
Jun 13, 2018
Synopsys IC Validator Certified by Samsung Foundry for 7nm Signoff Physical Verification
Apr 30, 2018
Synopsys Digital and Custom Design Platform Certified for TSMC's Most Advanced 5-nm Process Technology for Early Design Starts
Oct 12, 2017
Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX(TM) Process Technology
Sep 13, 2017
Mentor extends solutions to support TSMC 7nm FinFET Plus and 12nm FinFET process technologies
Sep 12, 2017
New Cadence Allegro PCB DesignTrue DFM Technology Accelerates New Product Development and Introduction Process
Sep 11, 2017
Synopsys IC Compiler II Certified for TSMC's Advanced 7-nm FinFET Plus Node
Jun 20, 2017
Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node
Jun 19, 2017
ANSYS And Synopsys To Partner In Accelerating Robust Design Optimization For Next Generation High-Performance Computing, Mobile And Automotive Products
Jun 13, 2017
Mentor and PhoeniX Software Offer New Integration to Speed Time to Tape-Out for Photonics Circuits
Jun 05, 2017
Mentor launches unique, end-to-end Xpedition High-Density Advanced Packaging flow