Jun 16, 2020
Mitsubishi Electric to Launch N-series 1200V SiC-MOSFET
Apr 23, 2020
Navitas Drives the GaN Power IC Patent Landscape
Apr 14, 2020
Silanna Semiconductor Expands Leading Position in Integrated Active Clamp Flyback Controller Market
Mar 30, 2020
Cree’s New 650V MOSFETs Offer Industry-leading Efficiency to Enable the Next Generation of Electric Vehicles, Data Centers and Solar Innovations
Mar 02, 2020
200V EPC2112 eGaN HEMT with Monolithic Optimized Gate Driver
Mar 02, 2020
200V EPC2112 eGaN HEMT with Monolithic Optimized Gate Driver
Feb 24, 2020
MagnaChip Launches New MOSFET to Enhance Protection for Wireless Earphones While Recharging
Feb 18, 2020
Mitsubishi Electric US, Inc. Semiconductor & Device Division to Exhibit New Products at the APEC Conference in New Orleans, LA, March 15-19
Jan 31, 2020
Global Power Transistors Market Set to Reach Over US$10.8 Billion by 2025
Dec 12, 2019
OMRON Releases World's First MOS FET Relay Module "G3VM-21MT" with Solid State Relay in "T-type Circuit Structure"
Nov 07, 2019
Transphorm Ships Over Half a Million GaN Power Devices for Multi-kilowatt Class Applications
Sep 30, 2019
Mitsubishi Electric Develops Trench-type SiC-MOSFET with Unique Electric-field-limiting Structure
Sep 24, 2019
MagnaChip Targets Fast-Growing e-Bike Market with High-Performance MOSFET
Sep 04, 2019
UnitedSiC Cascode JFET 650V Family Teardown Analysis 2019: Physical Analysis, Manufacturing Process, Cost Analysis, Price Analysis
Apr 15, 2019
Silanna Semiconductor Expands Line of Fully Integrated Active Clamp Flyback Controllers with 60W Version
Apr 02, 2019
2019 Power SiC Patent Landscape with a Comparison of Planar SiC MOSFETs vs. Trench SiC MOSFETs
Mar 18, 2019
Silanna Semiconductor Unveils World's First Fully Integrated Active Clamp Flyback Controller
Mar 18, 2019
UnitedSiC Announces Strategic Investment by Analog Devices
Mar 15, 2019
First isolated gate drivers with integrated sensing for IGBTs and SiC MOSFETs save energy and protect high-voltage systems
Jan 31, 2019
Transphorm Releases Quality and Reliability Data Behind Recently Announced Device Shipment Numbers