ASE Technology Holding Named Industry Leader in the 2018 Dow Jones Sustainability Indices

ASE Technology Holding Co., Ltd. (TAIEX: 3711, NYSE: ASX), the leading provider of semiconductor packaging, test and system assembly services, today announced that it has been included in the 2018 Dow Jones Sustainability Indices (DJSI) World and Emerging Market segments. This will also be the third year in a row that the company has been selected as the Industry leader in the Semiconductors and Semiconductor Equipment Industry Group. Its predecessor, Advanced Semiconductor Engineering Inc. was selected as industry leader in 2016 and 2017 respectively.

ASE Technology Holding was among 2,500 largest companies of the S&P Global Broad Market Index selected in the annual DJSI World assessment. Additionally, out of 55 companies assessed in the Semiconductors and Semiconductor Industry segment, only 6 of the companies including ASE Technology Holding made the cut on the DJSI World list.

“It is truly an honor to be included on the DJSI annual list in an industry that is so highly competitive,” said Jason Chang, Chairman of ASE Technology Holding. “Going forward, we will continue our sustainability efforts through pragmatic, honest and responsible practices that will create positive impact on both industry and society,” he continued.

Launched in 1999, the DJSI were the first global indices tracking the financial performance of leading sustainability-driven companies worldwide based on RobecoSAM’s analysis of financially material Environmental, Social, and Governance (ESG) factors and S&P DJI’s robust index methodology. For more information, please visit http://www.robecosam.com/en/sustainability-insights/about-sustainability/corporate-sustainability-assessment/industry-leaders.jsp

For more information on ASE Technology Holding Co., Ltd.’s corporate sustainability, please visit http://www.aseglobal.com/en/CSR/

About ASE Technology Holding Co., Ltd.

ASE Technology Holding Co., Ltd. is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, ASE Technology Holding develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services. For more information about ASE Technology Holding, visit www.aseglobal.com

Safe Harbor Notice

This press release contains “forward-looking statements” within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words “anticipate,” “believe,” “estimate,” “expect,” “intend,” “plan” and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the strained relationship between the Republic of China and the People’s Republic of China; general economic and political conditions; the recent global economic crisis; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors. For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including the 2017 Annual Report on Form 20-F for our predecessor company, Advanced Semiconductor Engineering, Inc., filed on March 28, 2018.