May 4, 2020   SOURCE: PR NewsWire

Global Silicon Wafer Area Shipments Edge Up in First Quarter 2020 Despite COVID-19 Headwinds

MILPITAS, Calif., May 4, 2020 /PRNewswire/ -- Worldwide silicon wafer area shipments rose 2.7 percent to 2,920 million square inches in the first quarter of 2020, compared with fourth-quarter 2019 shipments of 2,844 million square inches, but dropped 4.3 percent year-over-year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

"Global silicon wafer shipments rebounded slightly in the first quarter of 2020 after declining for one year," said Neil Weaver, chairman SEMI SMG and vice president, Product Development and Applications Engineering at Shin Etsu Handotai America. "However, with the disruptions caused by the coronavirus, market uncertainty will prevail in the upcoming quarters." 

                                                      Silicon Area Shipment Trends - Semiconductor
                                                                    Applications Only



                                                                                                Millions of Square Inches



                             4Q 2018          1Q 2019                       2Q 2019                       3Q 2019         4Q 2019    1Q 2020



                             Total              3,234                          3,051                          2,983            2,932       2,844    2,920

                                                                                                                                                 ---




     Source: SEMI (www.semi.org), April 2020

All data cited in this release includes polished silicon wafers such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products and consumer electronics. The highly engineered thin, round disks are produced in various diameters - from one inch to 12 inches - and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

A sub-committee of the SEMI Electronic Materials Group (EMG), the SMG is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The purpose of the SMG is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI(®) connects more than 2,260 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org

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SOURCE SEMI