TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems

Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies

/ Key Highlights

    --  Ansys multiphysics analysis solutions are critical to the successful
        integration and performance of advanced multi-chip packaging and
        electronic and photonic co-packaged optics in TSMC's compact universal
        photonics engine (COUPE)
    --  Ansys' joint development of design solutions for TSMC's N2P and A16(TM)
        advanced silicon processes ensure power integrity, electromigration
        reliability, and critical thermal management for compute-heavy
        applications like high-performance computing (HPC) and artificial
        intelligence (AI)
    --  Ansys collaborated on a new AI-assisted radio frequency (RF) process
        migration flow that automates circuit designs and improves product
        performance

PITTSBURGH, Oct. 25, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) was recognized at the TSMC 2024 Open Innovation Platform® (OIP) Partner of the Year awards for excellence in design enablement for AI, HPC, and photonics silicon systems. The awards honor TSMC OIP ecosystem partners and their contributions to innovation in next-generation 3D integrated circuit (3D-IC) design and enablement. Ansys received four awards for joint development of design solutions for multiphysics analysis, N2P and A16 power delivery, COUPE enablement, and RF design, optimization, and migration.

TSMC announced the award winners at its annual TSMC OIP Ecosystem Forum, which assembled semiconductor ecosystem partners and customers for a day of industry discussion around technological trends and design solutions. Ansys received the following Joint Development awards:

    --  Multiphysics: TSMC expanded the collaboration with Ansys RedHawk-SC
        Electrothermal(TM) thermal and multiphysics signoff platform,
        incorporating mechanical stress analysis solutions. In addition, TSMC,
        Ansys, and Synopsys developed an efficient flow to address multiphysics
        coupling challenges among timing, thermal, and power integrity. The flow
        seamlessly combines Synopsys' 3DIC Compiler(TM) exploration-to-signoff
        platform with Ansys multiphysics solutions RedHawk-SC Electrothermal and
        Ansys RedHawk-SC(TM) power integrity signoff platform for digital and
        3D-IC.
    --  N2P and A16: Ansys collaborated with TSMC to develop power integrity
        analysis, electromigration reliability analysis, and critical thermal
        management solutions for TSMC's N2P and A16 advanced silicon processes.
        The flow includes RedHawk-SC, Ansys Totem(TM) power integrity signoff
        platform, and RedHawk-SC Electrothermal.
    --  COUPE enablement: Ansys and TSMC delivered a high-fidelity multiphysics
        solution to address design and reliability challenges for the TSMC COUPE
        integration system. This includes Ansys Zemax OpticStudio(TM) optical
        system design and analysis software, Ansys Lumerical(TM) FDTD advanced
        3D electromagnetic FDTD simulation software, RedHawk-SC and Totem
        signoff platforms for multi-die power integrity signoff, Ansys
        RaptorX(TM) silicon optimized electromagnetic (EM) solver for design
        analysis and modeling for high-frequency EM analysis between dies, and
        RedHawk-SC Electrothermal for vital thermal management of the multi-die
        heterogenous system. Additionally, Lumerical allows custom Verilog-A
        models for electronic photonic circuit simulations, which work
        seamlessly with the TSMC Modeling Interface (TMI) and are co-designed
        with TSMC's Process Design Kit (PDK).
    --  RF design migration: Ansys collaborated with Synopsys and TSMC to
        combine the RaptorX electromagnetic modeling engine with Ansys
        optiSLang® process integration and design optimization software and
        Synopsys Custom Compiler and ASO.ai solution to automate the migration
        and optimization of analog circuits from one silicon process to another
        -- enhancing design efficiency, reliability, and scalability.

"Ansys is a key ecosystem partner that has worked relentlessly alongside TSMC to address our mutual customers' most complex design challenges," said Dan Kochpatcharin, head of the ecosystem and alliance management division at TSMC. "The awards celebrate OIP partners like Ansys who strive for excellence in design enablement, working closely with TSMC to accelerate advanced 3D IC design for the next generation of AI innovation."

"The Ansys multiphysics platform is integral to meeting designers' stringent design requirements for 3D-IC," said John Lee, vice president and general manager of electronics, semiconductor, and optics business unit at Ansys. "Without the Ansys multiphysics platform, the chips that are enabling the AI, HPC, and silicon systems growth would take demonstrably longer to develop and validate, and the associated costs would be much higher. Together, Ansys and TSMC push the industry forward by empowering our mutual customers to explore advanced packaging technologies, leverage the speed and power of AI, and enhance product performance and durability."

/ About Ansys

Our Mission: Powering Innovation that Drives Human Advancement(TM).

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

ANSS-T

     
             / Contacts



     Media                
     Mary Kate Joyce


                           
     724.820.4368


                                        marykate.joyce@ansys.com



     Investors            
     Kelsey DeBriyn


                           
     724.820.3927


                                        kelsey.debriyn@ansys.com

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