Worldwide Dicing Tapes Industry to 2027 - Impact Analysis of COVID-19 -

The "Dicing Tapes - Global Market Outlook (2019-2027)" report has been added to's offering.

The Global Dicing Tapes Market is expected to grow at a CAGR of 8.0% during the forecast period.

Increase in demand for small electronic components such as IC's & electronic chips and reducing thickness of electronic components are the major factors driving the market growth. However, the high cost of raw materials and high manufacturing costs are restraining market growth.

Dicing tapes are fundamentally designed to hold the semiconductor wafer during the process. This procedure separates the dies and furthermore keeps the chips inside close resistances regarding dimensions, position, etc. They are made of PVC or poly-ethylene with an adhesive to hold the dies in place. Significantly they are of two types. They are UV film sensitive tapes and silicone-free adhesive plastic films.

Based on coatings, the single sided segment is likely to have a huge demand due to increase in consumer choice for single sided coated dicing tapes, mainly for use in semiconductors, have led to this phase occupying a major market share across the globe. By geography, Asia Pacific is going to have a lucrative growth during the forecast period due to sheer number of electrical and electronic manufacturers in the region. China has emerged as an outstanding marketplace for dicing tape. There has also been a raised production of consumer durable electronic goods (CDEG) in the region.

Companies Mentioned

  • AI Technology Inc
  • Denka Company Limited
  • Denka electronics & products
  • Furukawa Electric Co Ltd
  • Lintec Corporation
  • Loadpoint Limited
  • Minitron Electronic GmbH
  • Mitsui Corporation
  • NEPTCO Inc
  • Nippon Pulse Motor Taiwan
  • Nitto Denko Corporation
  • Pantech Tape Co Ltd
  • Sumitomo Bakelite Co Ltd
  • Ultron Systems Inc

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter's five forces analysis, SWOT analysis, etc.
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Key Topics Covered:

1 Executive Summary

2 Preface

2.1 Abstract

2.2 Stake Holders

2.3 Research Scope

2.4 Research Methodology

2.4.1 Data Mining

2.4.2 Data Analysis

2.4.3 Data Validation

2.4.4 Research Approach

2.5 Research Sources

2.5.1 Primary Research Sources

2.5.2 Secondary Research Sources

2.5.3 Assumptions

3 Market Trend Analysis

3.1 Introduction

3.2 Drivers

3.3 Restraints

3.4 Opportunities

3.5 Threats

3.6 Application Analysis

3.7 Emerging Markets

3.8 Impact of Covid-19

4 Porters Five Force Analysis

4.1 Bargaining power of suppliers

4.2 Bargaining power of buyers

4.3 Threat of substitutes

4.4 Threat of new entrants

4.5 Competitive rivalry

5 Global Dicing Tapes Market, By Type

5.1 Introduction

5.2 Back Grinding

5.3 Wafer Dicing

6 Global Dicing Tapes Market, By Coating

6.1 Introduction

6.2 Single Sided

6.3 Double Sided

7 Global Dicing Tapes Market, By Material

7.1 Introduction

7.2 Non UV Curable Dicing Tapes

7.3 Silicon Free Adhesive Films

7.4 UV Curable Dicing Tapes

8 Global Dicing Tapes Market, By Strength

8.1 Introduction

8.2 Adhesive Strength

8.3 Elongation

8.4 Tensile Strength

9 Global Dicing Tapes Market, By Backing Material

9.1 Introduction

9.2 Ethylene Vinyl Acetate (EVA)

9.3 Polyethylene Terephthalate (PET)

9.4 Polyolefin (PO)

9.5 Polyvinyl Chloride (PVC)

10 Global Dicing Tapes Market, By Thickness

10.1 Introduction

10.2 Adhesive Thickness

10.3 Backing Film Thickness

10.4 Below 85 Microns

10.5 85-125 Microns

10.6 126-150 Microns

10.7 Above 150 Microns

11 Global Dicing Tapes Market, By Application

11.1 Introduction

11.2 Adhesive Control Needs

11.3 Ceramics

11.4 Glass

11.5 Package Dicing

11.6 Resin Substrate Manufacturing

12 Global Dicing Tapes Market, By Geography

12.1 Introduction

12.2 North America

12.2.1 US

12.2.2 Canada

12.2.3 Mexico

12.3 Europe

12.3.1 Germany

12.3.2 UK

12.3.3 Italy

12.3.4 France

12.3.5 Spain

12.3.6 Rest of Europe

12.4 Asia Pacific

12.4.1 Japan

12.4.2 China

12.4.3 India

12.4.4 Australia

12.4.5 New Zealand

12.4.6 South Korea

12.4.7 Rest of Asia Pacific

12.5 South America

12.5.1 Argentina

12.5.2 Brazil

12.5.3 Chile

12.5.4 Rest of South America

12.6 Middle East & Africa

12.6.1 Saudi Arabia

12.6.2 UAE

12.6.3 Qatar

12.6.4 South Africa

12.6.5 Rest of Middle East & Africa

13 Key Developments

13.1 Agreements, Partnerships, Collaborations and Joint Ventures

13.2 Acquisitions & Mergers

13.3 New Product Launch

13.4 Expansions

13.5 Other Key Strategies

14 Company Profiling

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